When it comes to reclaiming raw materials from Printed Circuit Boards, there are a number of technical challenges:
1. The large amount of plastics;
2. The large number of metals;
3. The very small quantities per metal;
4. The toxic substances;
5. The very complex alloys.
For this reason, our peers usually limit themselves to the low-hanging fruit, including:
Gold, Palladium, Silver and Copper. The residues are considered as waste and are disposed of.
In a truly unique single-line process, consisting of three main technologies, we will be able to recover more than 20 metals. From Q4 2020, we will start with 7 metals and add 7 new metals per year. Because our goal is maximum recovery, we also recover metals that cost more than they yield. That is not common in the metal production industry but we deem this necessary in the context of raw material dependency and scarcity.